![Dr. Peter Kürz (ZEISS) and Dr. Michael Kösters (TRUMPF) were awarded the Reinhard von Koenig Prize for Technology and Progress for their pioneering work in the development of High-NA EUV lithography.]({"xsmall":"https://www.zeiss.com.tw/content/dam/newsroom/pressphotos/awards-and-events/awards/rvk-price-winner_prev.jpg/_jcr_content/renditions/original.image_file.100.56.0,38,1916,1118.file/rvk-price-winner_prev.jpg","small":"https://www.zeiss.com.tw/content/dam/newsroom/pressphotos/awards-and-events/awards/rvk-price-winner_prev.jpg/_jcr_content/renditions/original.image_file.360.203.0,38,1916,1118.file/rvk-price-winner_prev.jpg","medium":"https://www.zeiss.com.tw/content/dam/newsroom/pressphotos/awards-and-events/awards/rvk-price-winner_prev.jpg/_jcr_content/renditions/original.image_file.768.432.0,38,1916,1118.file/rvk-price-winner_prev.jpg","large":"https://www.zeiss.com.tw/content/dam/newsroom/pressphotos/awards-and-events/awards/rvk-price-winner_prev.jpg/_jcr_content/renditions/original.image_file.1024.576.0,38,1916,1118.file/rvk-price-winner_prev.jpg","xlarge":"https://www.zeiss.com.tw/content/dam/newsroom/pressphotos/awards-and-events/awards/rvk-price-winner_prev.jpg/_jcr_content/renditions/original.image_file.1280.720.0,38,1916,1118.file/rvk-price-winner_prev.jpg","xxlarge":"https://www.zeiss.com.tw/content/dam/newsroom/pressphotos/awards-and-events/awards/rvk-price-winner_prev.jpg/_jcr_content/renditions/original.image_file.1440.810.0,38,1916,1118.file/rvk-price-winner_prev.jpg","max":"https://www.zeiss.com.tw/content/dam/newsroom/pressphotos/awards-and-events/awards/rvk-price-winner_prev.jpg/_jcr_content/renditions/original.image_file.1916.1078.0,38,1916,1118.file/rvk-price-winner_prev.jpg"})
![The image shows four people at the ceremonial opening of the new cleanroom space by ZEISS Semiconductor Manufacturing Technology at the Roßdorf site in Hesse. High-precision mask repair systems are developed there.]({"xsmall":"https://www.zeiss.com.tw/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/cleanroom-rossdorf_ribbon-cutting_prev.jpg/_jcr_content/renditions/original.image_file.100.56.0,101,1920,1181.file/cleanroom-rossdorf_ribbon-cutting_prev.jpg","small":"https://www.zeiss.com.tw/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/cleanroom-rossdorf_ribbon-cutting_prev.jpg/_jcr_content/renditions/original.image_file.360.203.0,101,1920,1181.file/cleanroom-rossdorf_ribbon-cutting_prev.jpg","medium":"https://www.zeiss.com.tw/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/cleanroom-rossdorf_ribbon-cutting_prev.jpg/_jcr_content/renditions/original.image_file.768.432.0,101,1920,1181.file/cleanroom-rossdorf_ribbon-cutting_prev.jpg","large":"https://www.zeiss.com.tw/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/cleanroom-rossdorf_ribbon-cutting_prev.jpg/_jcr_content/renditions/original.image_file.1024.576.0,101,1920,1181.file/cleanroom-rossdorf_ribbon-cutting_prev.jpg","xlarge":"https://www.zeiss.com.tw/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/cleanroom-rossdorf_ribbon-cutting_prev.jpg/_jcr_content/renditions/original.image_file.1280.720.0,101,1920,1181.file/cleanroom-rossdorf_ribbon-cutting_prev.jpg","xxlarge":"https://www.zeiss.com.tw/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/cleanroom-rossdorf_ribbon-cutting_prev.jpg/_jcr_content/renditions/original.image_file.1440.810.0,101,1920,1181.file/cleanroom-rossdorf_ribbon-cutting_prev.jpg","max":"https://www.zeiss.com.tw/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/cleanroom-rossdorf_ribbon-cutting_prev.jpg/_jcr_content/renditions/original.image_file.1920.1080.0,101,1920,1181.file/cleanroom-rossdorf_ribbon-cutting_prev.jpg"})
![In a white, brightly lit cleanroom stands a device for mask qualification. Two people in protective suits are working on the device.]({"xsmall":"https://www.zeiss.com.tw/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/aims-euv-3_prev.jpg/_jcr_content/renditions/original.image_file.100.56.0,192,1920,1272.file/aims-euv-3_prev.jpg","small":"https://www.zeiss.com.tw/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/aims-euv-3_prev.jpg/_jcr_content/renditions/original.image_file.360.203.0,192,1920,1272.file/aims-euv-3_prev.jpg","medium":"https://www.zeiss.com.tw/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/aims-euv-3_prev.jpg/_jcr_content/renditions/original.image_file.768.432.0,192,1920,1272.file/aims-euv-3_prev.jpg","large":"https://www.zeiss.com.tw/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/aims-euv-3_prev.jpg/_jcr_content/renditions/original.image_file.1024.576.0,192,1920,1272.file/aims-euv-3_prev.jpg","xlarge":"https://www.zeiss.com.tw/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/aims-euv-3_prev.jpg/_jcr_content/renditions/original.image_file.1280.720.0,192,1920,1272.file/aims-euv-3_prev.jpg","xxlarge":"https://www.zeiss.com.tw/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/aims-euv-3_prev.jpg/_jcr_content/renditions/original.image_file.1440.810.0,192,1920,1272.file/aims-euv-3_prev.jpg","max":"https://www.zeiss.com.tw/content/dam/newsroom/pressphotos/products/semiconductor-manufacturing-technology/aims-euv-3_prev.jpg/_jcr_content/renditions/original.image_file.1920.1080.0,192,1920,1272.file/aims-euv-3_prev.jpg"})
![對晶片結構的看法]({"xsmall":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/smt_magazin_keyvisual_stage_web.jpg/_jcr_content/renditions/original.image_file.100.50.356,0,1564,604.file/smt_magazin_keyvisual_stage_web.jpg","small":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/smt_magazin_keyvisual_stage_web.jpg/_jcr_content/renditions/original.image_file.360.180.356,0,1564,604.file/smt_magazin_keyvisual_stage_web.jpg","medium":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/smt_magazin_keyvisual_stage_web.jpg/_jcr_content/renditions/original.image_file.768.384.356,0,1564,604.file/smt_magazin_keyvisual_stage_web.jpg","large":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/smt_magazin_keyvisual_stage_web.jpg/_jcr_content/renditions/original.image_file.1024.512.356,0,1564,604.file/smt_magazin_keyvisual_stage_web.jpg","xlarge":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/smt_magazin_keyvisual_stage_web.jpg/_jcr_content/renditions/original.image_file.1208.604.356,0,1564,604.file/smt_magazin_keyvisual_stage_web.jpg","xxlarge":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/smt_magazin_keyvisual_stage_web.jpg/_jcr_content/renditions/original.image_file.1208.604.356,0,1564,604.file/smt_magazin_keyvisual_stage_web.jpg","max":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/smt_magazin_keyvisual_stage_web.jpg/_jcr_content/renditions/original.image_file.1208.604.356,0,1564,604.file/smt_magazin_keyvisual_stage_web.jpg"} "SMT雜誌")
![半導體結構象徵數位時代]({"xsmall":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/smt_magazin_keyvisual_stage_web.jpg/_jcr_content/renditions/original.image_file.100.100.872,0,1474,602.file/smt_magazin_keyvisual_stage_web.jpg","small":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/smt_magazin_keyvisual_stage_web.jpg/_jcr_content/renditions/original.image_file.360.360.872,0,1474,602.file/smt_magazin_keyvisual_stage_web.jpg","medium":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/smt_magazin_keyvisual_stage_web.jpg/_jcr_content/renditions/original.image_file.602.602.872,0,1474,602.file/smt_magazin_keyvisual_stage_web.jpg","large":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/smt_magazin_keyvisual_stage_web.jpg/_jcr_content/renditions/original.image_file.602.602.872,0,1474,602.file/smt_magazin_keyvisual_stage_web.jpg","xlarge":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/smt_magazin_keyvisual_stage_web.jpg/_jcr_content/renditions/original.image_file.602.602.872,0,1474,602.file/smt_magazin_keyvisual_stage_web.jpg","xxlarge":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/smt_magazin_keyvisual_stage_web.jpg/_jcr_content/renditions/original.image_file.602.602.872,0,1474,602.file/smt_magazin_keyvisual_stage_web.jpg","max":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/smt_magazin_keyvisual_stage_web.jpg/_jcr_content/renditions/original.image_file.602.602.872,0,1474,602.file/smt_magazin_keyvisual_stage_web.jpg"} "SMT雜誌")
洞察未來科技趨勢
我們致力於推動微型化、高效能且節能的晶片技術，引領數位化浪潮向前邁進。深入瞭解創新技術、未來趨勢及其幕後推手。
![一名坐在筆電前的使用者，關注半導體製造領域的新聞。]({"xsmall":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/news-events-zeiss-smt.jpg/_jcr_content/renditions/original.image_file.100.56.14,0,1987,1110.file/news-events-zeiss-smt.jpg","small":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/news-events-zeiss-smt.jpg/_jcr_content/renditions/original.image_file.360.203.14,0,1987,1110.file/news-events-zeiss-smt.jpg","medium":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/news-events-zeiss-smt.jpg/_jcr_content/renditions/original.image_file.768.432.14,0,1987,1110.file/news-events-zeiss-smt.jpg","large":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/news-events-zeiss-smt.jpg/_jcr_content/renditions/original.image_file.1024.576.14,0,1987,1110.file/news-events-zeiss-smt.jpg","xlarge":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/news-events-zeiss-smt.jpg/_jcr_content/renditions/original.image_file.1280.720.14,0,1987,1110.file/news-events-zeiss-smt.jpg","xxlarge":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/news-events-zeiss-smt.jpg/_jcr_content/renditions/original.image_file.1440.810.14,0,1987,1110.file/news-events-zeiss-smt.jpg","max":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/news-events-zeiss-smt.jpg/_jcr_content/renditions/original.image_file.1920.1080.14,0,1987,1110.file/news-events-zeiss-smt.jpg"} "蔡司半導體的最新消息與活動")
蔡司半導體最新消息與活動
資訊與活動 半導體製造科技的動態
掌握蔡司半導體的最新消息，並閱讀雜誌深入探索半導體製造科技（SMT）的多元化世界。在媒體專區，您將找到新聞稿、聯絡方式、圖片以及社群媒體動態。密切關注實體與數位平台的最新活動資訊，掌握所有動態。
社群媒體
蔡司半導體頻道
![Jeannine Rapp的個人檔案照片]({"xsmall":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/jeannine_rapp.jpg/_jcr_content/renditions/original.image_file.100.100.125,0,875,750.file/jeannine_rapp.jpg","small":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/jeannine_rapp.jpg/_jcr_content/renditions/original.image_file.360.360.125,0,875,750.file/jeannine_rapp.jpg","medium":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/jeannine_rapp.jpg/_jcr_content/renditions/original.image_file.750.750.125,0,875,750.file/jeannine_rapp.jpg","large":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/jeannine_rapp.jpg/_jcr_content/renditions/original.image_file.750.750.125,0,875,750.file/jeannine_rapp.jpg","xlarge":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/jeannine_rapp.jpg/_jcr_content/renditions/original.image_file.750.750.125,0,875,750.file/jeannine_rapp.jpg","xxlarge":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/jeannine_rapp.jpg/_jcr_content/renditions/original.image_file.750.750.125,0,875,750.file/jeannine_rapp.jpg","max":"https://www.zeiss.com.tw/content/dam/smt/news-events/overview-news-events/jeannine_rapp.jpg/_jcr_content/renditions/original.image_file.750.750.125,0,875,750.file/jeannine_rapp.jpg"} "Jeannine Rapp")
蔡司半導體媒體聯絡人
Jeannine Rapp
溝通及集團專案執行負責人