Structural Analysis
An important factor in modern integrated circuit (IC) packaging is to understand the microstructures of circuit components and devices. To meet the market demand for faster, more powerful and portable devices, 3D architectures in modern electronics are becoming increasingly complex due to continuous downscaling and miniaturization. Microfabrication processes require interconnecting elements, such as bumps, pillars and TSVs, to be well-structured and positioned in functional circuitry. Accordingly, the development of more suitable microscopic analysis methods is required to validate new process workflows. ZEISS 3D X-ray microscopy has emerged as a structural analysis solution for the superior contrast and high resolution over large working distances, which enable structural characterization without the need to destroy specimens.
Characterization & Analysis
- Virtually cross-section complex, multi-layered 3D IC packages (prior to physical cross-section)
- Obtain detailed structural information and generate 3D virtual models of advanced packages
- Characterize structures of individual C4 bumps, microbumps, copper pillars, TSVs, etc., of large-sized packages
- Reveal structural defects and failures that cause electrical opens/shorts
- Provide precise geometric guidance for physical cross-section
- Use high-resolution volumetric data to review features at any point within your device
- Audit wafer-level packaging process development by imaging die-on-wafer or wafer-on-wafer
- Image subsurface details for structural integrity: bumps, TSVs, and copper pillars
- Map internal wiring structures in packages
- Acquire high resolution datasets (down to one µm voxel) for 200/300mm wafers
- Observe and quantify interconnect morphology/alignment and characterize processing quality
- Measure the impact of stress conditions such as packages under accelerated thermal cycles
- Establish prior artwork and expose counterfeiting and tampering through microstructural observation of cellphones, tablets, hearing aids, speakers, optics, and other devices or device components
- Image active component in micro-acoustical devices such as microphones, small transformers
- Image cutting-edge camera lens devices to provide high-value statistics for monitoring production processes
- Use Autoloader to load multiple packages at a time to improve imaging throughput
The Link to Correlative Microscopy
The new FA workflow: identify the approximate region of interest (ROI) with a low-resolution non-destructive technique. Use ZEISS Xradia Versa to zoom in on ROI within a package to produce submicron resolution images for deep visualization and failure classification. Perform progressive testing and additional experiments, re-imaging non-destructively. For the final step, mechanical cross-sectioning via FIB-SEM saves a significant amount of time since XRM data provides detailed structural information prior to doing so.